New Components Division
Into the New Areas of Core Technology
CMP
It cleans polishing pad of CMP (chemical mechanical polishing) that supports semiconductor devices that continue integration, contributing to pad life and reduction of micro-scratches.
Removal of Processing Burr
Fine burrs are also generated on glass products by processing. If HPMJ is used, only unnecessary burrs can be removed while suppressing damage to the base material.
Anti-Fingerprint Film
This is an example of a fingerprint adhesion prevention film that is in increasing demand for touch panels. The film thickness is controlled in the range of a few nm to 100nm.
Please feel free to contact with our division for any questions or concerns you might have about Precision cleaning equipment, Precision spray coating equipment and sensing technologies.